Master's Thesis: NanoFlat-Metallization for Radio Frequency Low-Loss Devices

As RF and high-frequency electronics advance, conductor surface roughness increasingly affects signal quality and transmission losses. This master's thesis explores how to produce exceptionally smooth surfaces and durable metal films on glass, ceramics and polymers. The goal is to support manufacturing processes for next-generation low-loss RF and microwave devices.

The assignment

• Investigate and optimize surface-smoothing methods, including chemical–mechanical polishing and plasma treatment, to reduce substrate roughness.
• Develop reliable, low-loss metallization processes using approaches such as sputtering, electroplating and seed-layer engineering.
• Work toward metal films with high electrical conductivity and strong adhesion under high-frequency operating conditions.

Who we are looking for

• Master's-level background in materials science, RF and microwave engineering, or electromagnetics.
• Strong spoken and written English.
• Ability to work independently and collaborate effectively with others.
• Careful working style and a focus on research quality.
• Experience with chemical–mechanical planarization or metallization of ultra-smooth ceramic and glass substrates is advantageous.
• Laboratory or testing experience and familiarity with international, multicultural workplaces are desirable.

What we offer

• Close collaboration with engineering teams in Sweden and Huawei's headquarters in China.
• Hands-on research in university laboratories.
• An opportunity to contribute to materials and process development for future low-loss RF devices.

Practical details

Location: Kista. Planned start: spring 2027. The project seeks one master's student.